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Part number: ME7155-3
AI Technology ME7155-3 is a slightly lower bond strength but more flexible version of ME7155. The ME7155-3 exhibits excellent flexibility for bonding materials with highly mismatched CTE's (i.e. alumina to aluminum, silicon to copper). The high thermal conductivity of this material makes it favorable for bonding high-powered, large area die and components. It can be easily reworked at 80 to 100 ºC and is available in syringes for automatic needle dispensing applications or in jars. 10 cc EFD Syringe.
| Typical Use: | Ideal for high power die attach, re-workability, and mismatched CTE's. |
| Chemical Composition: | Alumina |
| Components: | 1 part |
| Cure System: | Heat |
| Cure Time: | 8h @ 80 °C; 4h @ 100 °C; 2h @ 125 °C; 1h @ 150 °C |
| Dielectric Strength: | 750 V/mil |
| Hardness: | 80 A |
| Service Temperature: | 80 to 100 °C |
| Shear Strength: | 800 |
| Thermal Conductivity: | 1.7 W/mC |
| Viscosity: | 175,000 |
